
R/F
-
-
48
详情 -
044
详情 -
043
详情 -
042
详情 -
6floors
MC P/N: T060_LDAC_V1.5_221028
详情
Layer number: 6
Sheet thickness: 0.6 mm +/-0.08 mm
Surface treatment: ENIG
Material type: FCCL+FR4
Application: Headphone
PCB structure: 1R+1R+2F+1R+1R
Minimum through-hole: 800 microns
Minimum laser hole: 100 microns
Minimum line width: 110 microns
Minimum line spacing: 70 microns
Board standard: CLASS II -
38
详情 -
6floors
MC P/N: C06R20643X01
详情
Layer No.: 6
Board thickness: 0.6mm +/-0.1mm
Surface treatment: ENIG
Material type: FCCL+FR4
Application: Consumer electronics
PCB structure: 1R+1R+2F+1R+1R
Minimum through-hole: NA
Minimum laser hole: 100 microns
Minimum line width: 100 microns
Minimum line spacing: 50 microns
Board standard: CLASS II -
6floors
MC P/N: AN00100267A0
详情
Layer No.: 6
Board thickness: 1.2 mm +/-0.12 mm
Surface treatment: ENIG
Material type: FCCL+FR4
Application: Industrial Control
PCB structure: 1R+1R+2F+1R+1R
Minimum through-hole: 250 microns
Minimum laser hole: 100 microns
Minimum line width: 100 microns
Minimum line spacing: 100 microns
Board standard: CLASS III -
035
详情 -
033
详情 -
10floors
MC P/N: C10R20256X01
详情
Layer No.: 10
Board thickness: 2.0 mm +/-2.0 mm
Surface treatment: ENIG
Material type: FCCL+FR4
Application: Industrial control
PCB structure: 3R+4F+3R
Minimum through-hole: 200 microns
Minimum laser hole: /
Minimum line width: 76.2 microns
Minimum line spacing: 76.2 microns
Board standard: CLASS III -
29
详情 -
28
详情 -
27
详情 -
10floors
MC P/N: C10R20255X01
详情
Layer No.: 10
Board thickness: 2.0 mm +/-2.0 mm
Surface treatment: ENIG
Material type: FCCL+FR4
Application: Industrial control
PCB structure: 3R+4F+3R
Minimum through-hole: 200 microns
Minimum laser hole: /
Minimum line width: 76.2 microns
Minimum line spacing: 76.2 microns
Board standard: CLASS III -
6floors
MC P/N: 6S001-00562A0
详情
Layer number: 6
Panel thickness: 1.0 mm +/-0.1 mm
Surface treatment: ENIG
Material type: FCCL+FR4
Application: Mechanical control
PCB structure: 2R+2F+2R
Minimum through-hole: 200 microns
Minimum laser hole: NA
Minimum line width: 150 microns
Minimum line spacing: 100 microns
Board standard: CLASS III
-
4floors
MC P/N: 4C31600009A0
详情
Layer No.: 4
Sheet thickness: 0.6mm +/-0.1mm
Surface treatment: ENIG
Material type: FCCL+FR4
Application: Consumer Electronics
PCB structure: 1R+2F+1R
Minimum through-hole: 200 microns
Minimum laser hole: NA
Minimum line width: 120 microns
Minimum line spacing: 100 microns
Board standard: CLASS II